manufacturing
Three-inspection for key processes
first inspection>>> self-inspection>>>tour inspection
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Self-inspection in the operator process-Die Bond -
Self-inspection in the operator process-Wire Bond -
Self-inspection in the operator process-Coating -
Self-inspection in the operator process-inspection -
Self-inspection in the operator process -AOI inspection -
Self-inspection in the operator process-Sorting -
Self-inspection in the operator process-Visual inspection
Reliable labs
Matching equipment-based testing and reliable equipment for quality control from bringing in materia
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Bracket toughness tester -
Peeling force tester -
Electroplating coating tester -
Autonomous push/pull tester -
Thermal shock tester -
Everfine HAAS3000 precision quick spectrum scanner -
Everfine HAAS2000 precision spectral testing machine -
LED automatic temperature control testing system -
Room temperature system&LED high-temperature system -
LED constant temperature and humidity testing machine -
High-grade metallographic microscope -
SEM desktop scanning electron microscope -
Eight-warm-area reflow soldering machine -
X-Ray
Independent labs for analyzing failed products and testing the reliability of mass-production products
In R&D for actual production, life tests should be done for LED lamps’ reliability to utilize quality feedback to improve reliability and ensure quality.
Product Development Experiment Project
| Classification | Experiment conditions | Sample quantity | Judgment standards |
|---|---|---|---|
| Thermal shock test | （-40℃±5℃?125±5℃） Time: 30min/cycle, 500 cycles |
2000 | Failure rate≤0 |
| High-temperature high-humidity aging | Temperature (Ta):85℃±5℃，Humidity(RH):85% 168H/500H/1000H |
22 | Light decay rate≤10%， Single-lamp light decay rate ≤15%, x/y hue drift <0.01 |
| ORT | 150℃/1H->Temperature(Ta):85℃±5℃， Humidity(RH):85%/8H+reflow soldering of three times（MAX260℃/10S)-> Thermal shock test 100cycle (Regular) |
2000 | Failure rate≤0 |
| Cold and heat ratio test | 25℃±5℃?85±5℃?105±5℃ Luminous flux differences of test materials |
10 | High/low luminous flux differences Average value≥85% |
| High-temperature aging | 85℃±5℃（PPA）/ 105℃±5℃（PCT） 168H/500H/1000H chip rated current |
22 | Light decay rate≤5%，Hue drift <0.01 |
| Gas tightness | Reflow soldering（260℃/10s）Industrial ethanol 1:1 red ink， Boiling for 2H/Heating table temperature set at 150℃, observed every one hour |
10 | PPA/PCT copper lead frame with no leakage for 2H |
| Vulcanization | 105℃±5℃/2H,materials placed at the contain top, tested every 1H. | 10 | Average value decay rate≤10%，Single-lamp maximum ≤15% |
| Normal-temperature aging | Temperature(Ta):25℃±5℃ 168H/500H /1000H | 22 | Hue drift＜0.01， Light decay 500 average value decay rate ≤2% (1000H average value decay rate≤5%） Single-lamp should be ≤8%, negative light decay allowable |
| Impulse experiment | One second per time (0.5S respectively to on and off)/ The electrical current should be the maximum value in chip design，Aging168/500H |
22 | Light decay rate≤5%，Hue drift <0.01 |
| MST | Temperature(Ta):105℃±5℃168H，1.5 times the rated current | 10 | Voltage excursion ≤±5％ |
ORT processes for shipping spot-check
Before shipping, a spot-check is done for rigorous reliability testing to ensure delivering quality products to customers
Spot-check different product work orders for reliability tes
High-temperature and high-humidity(85 ℃ 85%/8Hrs)
Three times of reflow soldering（MAX260℃/10s)
Thermal shock test 100 cycle
(-40 ℃/15min-125 ℃/15min)
(-40 ℃/15min-125 ℃/15min)
High-temperature aging(105 ℃/168Hrs)
Judgment standards：
Shipping without any abnormalities such
Shipping without any abnormalities such
